Long term accuracy, and linearity limitations of piezoresistive pressure sensors has restricted applications to relatively stable environments until now. Advances in EG&G IC Sensors' silicon, micromachined pressure sensors have reduced temperature dependence by a factor of 5, enabling wider applicability in portable instruments and process environments.

An ultra-stable silicon die and isolation diaphragm design from EG&G IC Sensors improves pressure sensor performance and lowers cost. The company reports that, compared to current products, the new Model 86 reduces linearity errors by 50% and substantially reduces temperature errors over the much wider compensated range of -20°C to +85°C

Higher performance and reduced OEM pricing significantly increase application potential for the EG&G IC Sensors Model 1451 pressure sensor, the company reports. The new silicon die cuts production costs and has better stability and linearity than is typical of comparable piezo electric devices. Options such as gauge or absolute pressure ranges, large or small ports, and compatibility with automated assembly further enhance application diversity.