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PI Bond25 February 2018

10nm pattern generation using thermal scanning probe lithography enabled by simplified materials and processes

/ins Thermal scanning probe lithography (tSPL) has been used to create patterns with sub-20 nm half pitch resolution. Pattern generation uses a thermally sensitive resist and spin coatable hard mask materials to transfer the resist patterns. Spin coatable materials permit users of tSPL to reduce tim

From the INS archiveEN

PI Bond19 October 2016

PiBond pioneers a new material approach for MEMS and 3D IC manufacturing.

/INS. PiBond today announced the latest key milestone in its innovative SAP platform. SAP’s metal oxide solution revolutionizes the way in which manufacturers deal with ever increasing cost structures resulting from more complex designs. These materials boast higher etch selectivity than anything cu

From the INS archiveEN

PI Bond21 September 2016

New materials with high refractive index for optical applications

/INS . Rapidly emerging global megatrends such as Internet of Things, augmented reality as well as new waves of automotive and security related applications have become key factors in an increasing demand for imaging sensors. The growing number of different applications place new requirements for ma

From the INS archiveEN

Press release archive

/3 releases

10nm pattern generation using thermal scanning probe lithography enabled by simplified materials and processes

PiBond pioneers a new material approach for MEMS and 3D IC manufacturing.

New materials with high refractive index for optical applications

3 releases